• Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Coordinate baseline defect yield improvement and issue solving for achieveing yield target • Defense line shift left and summarized • Prefer Process integration, product and R&D engineer with massive data analysis and report summary required • Well coordination, communication, postivity to overcome pressure with team work • Prefer advanced 2.5D/3D/HBM/wafer level assembly package related over 3 years • English communication ability
