Job Description Responsibilities and Tasks: • Installation, accountable and sustain for Debond equipment.
• Backup for bond area equipment basic maintenance.
• Establish and improve process condition and technology. • Upgrade tool capability and improve product quality. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement.
Requirement: • Preferred to have over 3-year of working experiences in production line. • Must have equipment maintain experience. • Bachelor degree or above.
